Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability
Pecht
Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability / Michael Pecht. - New York John Wiley & Sons 1994. - xxxi, 426p. ill. 24cm
Includes bibliographical references
0471594466
Electronic packaging--Design
Hybrid integrated circuits--Design and construction
Multichip modules (Microelectronics)--Design and construction
621.381046 PEC 1994
Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability / Michael Pecht. - New York John Wiley & Sons 1994. - xxxi, 426p. ill. 24cm
Includes bibliographical references
0471594466
Electronic packaging--Design
Hybrid integrated circuits--Design and construction
Multichip modules (Microelectronics)--Design and construction
621.381046 PEC 1994