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Electronic packaging : design, materials, process, and reliability

Electronic packaging : design, materials, process, and reliability / John H. Lau...[et al.]. - New York McGraw Hill 1998. - xxiv. 498p. ill. 23cm - Electronic packaging and interconnection series .

Includes bibliographical references and index

ISBN: 0070371350

Subjects--Topical Terms:
Electronic packaging

Dewey Class. No.: 621.381046 ELE 1998

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