Normal view MARC view ISBD view

Reliability of electronic packages and semiconductor devices

DI GIACOMO

Reliability of electronic packages and semiconductor devices / Giulio Di Giacomo. - New York McGraw Hill 1997. - xiv, 410p. ill. 24cm - Electronic packaging and interconnection series .

Includes index

ISBN: 007017024X

Subjects--Topical Terms:
Microelectronic packaging--Reliability
Semiconductors--Reliability

Dewey Class. No.: 621.381046 DIG 1997

Print
Add to your cart (remove)
Suggest for purchase
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS ISBD
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)