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Modern solder technology for competitive electronics manufacturing

HWANG

Modern solder technology for competitive electronics manufacturing / Jennie S. Hwang. - New York McGraw Hill 1996. - xliv, 622p. ill. 24cm - Electronic packaging and interconnection series .

Includes bibliographical references and index

ISBN: 0070317496

Subjects--Topical Terms:
Electronic packaging
Solder and soldering

Dewey Class. No.: 621.381046 HWA 1996

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