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3D IC stacking technology

3D IC stacking technology / Banqiu Wu, Ajay Kumar, Sesh Ramaswami, editors. - 1st ed.. - New York McGraw-Hill Professional c2011. - xviii, 521p ill 24cm

ISBN: 9780071741958

Subjects--Topical Terms:
Microelectronic packaging
Three-dimensional integrated circuits

Dewey Class. No.: 621.38153 THR 2011

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