Quality conformance and qualification of microelectronic packages and interconnects
Quality conformance and qualification of microelectronic packages and interconnects
/ editors Michael Pecht (et...al).
- New York John Wiley & Sons, Inc 1993.
- xxxiii, 461p. ill. 24cm
0471594369
Electronic packaging--Defects
Electronic packaging--Quality control
Electronic packaging--Testing
Quality assurance
621.381046 QUA 1993
0471594369
Electronic packaging--Defects
Electronic packaging--Quality control
Electronic packaging--Testing
Quality assurance
621.381046 QUA 1993