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Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harman.

By: Material type: TextTextPublication details: New York McGraw-Hill 1997.Edition: 2nd edDescription: xiv, 290p. ill. 24cmISBN:
  • 0070326193
Subject(s): DDC classification:
  • 621.3815 HAR 1997
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Holdings
Item type Current library Call number Copy number Status Date due Barcode
Book-GN Book-GN PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH 621.3815 HAR 1997 (Browse shelf(Opens below)) 15140 Available 0000016191
Book-GN Book-GN PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH 621.3815 HAR 1997 (Browse shelf(Opens below)) 15141 Available 0000016192
Book-GN Book-GN PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH 621.3815 HAR 1997 (Browse shelf(Opens below)) 15142 Available 0000016193

Includes index

Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.

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