Multichip module design, fabrication and testing / James J. Licari.

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Material type: Text

TextPublication details: New York McGraw Hill 1995.Description: 381p. ill. 24cmISBN:

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Holdings
Item type	Current library	Call number	Copy number	Status	Date due	Barcode
Book-GN	PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH	621.381046 LIC 1995 (Browse shelf(Opens below))	6855	Available		0000007852

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Previous	621.381046 LAU 1997 Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies	621.381046 LAU 1997 Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies	621.381046 LAU 1997 Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies	621.381046 LIC 1995 Multichip module design, fabrication and testing	621.381046 MIC 2003 Microelectronic packaging	621.381046 MIC 2003 Microelectronic packaging	621.381046 PEC 1994 Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability	Next

Includes index

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