Lau  <br/><br/>
Chip scale package, CSP : design, materials, processes, reliability, and applications  
/ John H. Lau, Shi-Wei Ricky Lee. 
 - New York  McGraw Hill  1999. 
 - xxii, 564p.  ill.  25cm 
<br/><br/> Includes index 
<br/><br/><label>ISBN: </label>0070383049  
<br/><br/><label>Subjects--Topical Terms: </label><br/>Integrated circuits--Design and construction<br/>Microelectronic packaging
<br/><br/><label>Dewey Class. No.: </label>621.3815 LAU 1999