TY  - BOOK
AU  - Harman 
TI  - Wire bonding in microelectronics : materials, processes, reliability, and yield 
SN  - 0070326193 
U1  - 621.3815 HAR 1997 
PY  - 1997///
CY  - New York
PB  - McGraw-Hill
KW  - Electronic packaging
KW  - Defects
KW  - Reliability
KW  - Wire bonding (Electronic packaging)
KW  - Production control
N1  - Includes index; Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989
ER  -