TY  - BOOK
AU  - HWANG 
TI  - Modern solder technology for competitive electronics manufacturing 
T2  - Electronic packaging and interconnection series
SN  - 0070317496 
U1  - 621.381046 HWA 1996 
PY  - 1996///
CY  - New York
PB  - McGraw Hill
KW  - Electronic packaging
KW  - Solder and soldering
N1  - Includes bibliographical references and index
ER  -