TY  - BOOK
AU  - Jawitz, Martin W.
TI  - Printed circuit board materials handbook 
T2  - Electronic packaging and interconnection series
SN  - 0070324883 
U1  - 621.381531 PRI 1997 
PY  - 1997///
CY  - New York
PB  - McGraw Hill
KW  - Printed circuits
KW  - Design and construction
KW  - Handbooks, manuals, etc
KW  - Materials
N1  - Includes bibliographical references and index
ER  -