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Quality conformance and qualification of microelectronic packages and interconnects / editors Michael Pecht (et...al). by
  • Pecht, Michael
Material type: Text Text
Publication details: New York John Wiley & Sons, Inc 1993
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 621.381046 QUA 1993.

Electronic packaging materials and their properties / Michael G. Pecht ... [et al.]. by
  • Pecht, Michael
Series: Electronic packaging series
Material type: Text Text
Publication details: Boca Raton CRC Press c1999
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 621.381046 ELE 1999.

Contamination of electronic assemblies / Michael Pecht ... [et al.]. by
  • Pecht, Michael
Series: Electronic packaging series
Material type: Text Text
Publication details: Boca Raton CRC Press 2003
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 621.381046 CON 2003.

Product reliability, maintainability, and supportability handbook; edited by Michael Pecht. by
  • Pecht, Michael
  • ARINC Research Corporation
Material type: Text Text
Publication details: Boca Raton CRC Press 1995
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 620.0045 PRO 1995.

Product reliability, maintainability, and supportability handbook; edited by Michael Pecht. by
  • Pecht, Michael
Edition: 2nd ed..
Material type: Text Text
Publication details: Boca Raton CRC Press 2009
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 658.575 PRO 2009.

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