Normal view MARC view ISBD view

Chip scale package, CSP : design, materials, processes, reliability, and applications

Lau

Chip scale package, CSP : design, materials, processes, reliability, and applications / John H. Lau, Shi-Wei Ricky Lee. - New York McGraw Hill 1999. - xxii, 564p. ill. 25cm

Includes index

ISBN: 0070383049

Subjects--Topical Terms:
Integrated circuits--Design and construction
Microelectronic packaging

Dewey Class. No.: 621.3815 LAU 1999

Print
Add to your cart (remove)
Suggest for purchase
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS ISBD
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)