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Chip scale package, CSP : design, materials, processes, reliability, and applications / John H. Lau, Shi-Wei Ricky Lee.
Material type:
TextPublication details: New York McGraw Hill 1999.Description: xxii, 564p. ill. 25cmISBN: - 0070383049
- 621.3815 LAU 1999
| Item type | Current library | Call number | Copy number | Status | Date due | Barcode |
|---|---|---|---|---|---|---|
Book-GN
|
PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH | 621.3815 LAU 1999 (Browse shelf(Opens below)) | 16703 | Available | 0000017780 | |
|
Book-GN
|
PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH | 621.3815 LAU 1999 (Browse shelf(Opens below)) | 16704 | Available | 0000017781 | |
|
Book-GN
|
PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH | 621.3815 LAU 1999 (Browse shelf(Opens below)) | 16705 | Available | 0000017782 | |
|
Book-GN
|
PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH | 621.3815 LAU 1999 (Browse shelf(Opens below)) | 18388 | Available | 0000019478 | |
|
Book-GN
|
PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH | 621.3815 LAU 1999 (Browse shelf(Opens below)) | 18389 | Available | 0000019479 | |
|
Book-GN
|
PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH | 621.3815 LAU 1999 (Browse shelf(Opens below)) | 18390 | Available | 0000019480 | |
|
Book-GN
|
PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH | 621.3815 LAU 1999 (Browse shelf(Opens below)) | 23200 | Available | 0000024315 | |
|
Book-GN
|
PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH | 621.3815 LAU 1999 (Browse shelf(Opens below)) | 23201 | Available | 0000024316 | |
|
Book-GN
|
PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH | 621.3815 LAU 1999 (Browse shelf(Opens below)) | 23202 | Available | 0000024317 |
Includes index
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