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Flip chip technologies

Flip chip technologies / editor, John H. Lau. - New York McGraw Hill 1996. - xxiv, 565p. ill. 24cm - Electronic packaging and interconnection series .

ISBN: 0070366098

Subjects--Topical Terms:
Microelectronic packaging
Multichip modules (Microelectronics)--Design and construction

Dewey Class. No.: 621.381046 FLI 1996

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