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Flip chip technologies / editor, John H. Lau.

Contributor(s): Material type: TextTextSeries: Electronic packaging and interconnection seriesPublication details: New York McGraw Hill 1996.Description: xxiv, 565p. ill. 24cmISBN:
  • 0070366098
Subject(s): DDC classification:
  • 621.381046 FLI 1996
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Holdings
Item type Current library Call number Copy number Status Date due Barcode
Book-GN Book-GN PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH 621.381046 FLI 1996 (Browse shelf(Opens below)) 6753 Available 0000007746

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