Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies

Lau

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies / authors, John H. Lau and Yi-Hsin Pao. - New York McGraw Hill 1997. - xxi, 408p. ill. 24cm

Includes bibliographical references and index

0070366489


Microelectronic packaging--Reliability
Multichip modules (Microelectronics)--Testing
Semiconductors--Reliability
Solder and soldering--Testing

621.381046 LAU 1997