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Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies / authors, John H. Lau and Yi-Hsin Pao.

By: Contributor(s): Material type: TextTextPublication details: New York McGraw Hill 1997.Description: xxi, 408p. ill. 24cmISBN:
  • 0070366489
Subject(s): DDC classification:
  • 621.381046 LAU 1997
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Holdings
Item type Current library Call number Copy number Status Date due Barcode
Book-GN Book-GN PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH 621.381046 LAU 1997 (Browse shelf(Opens below)) 6864 Available 0000007861
Book-GN Book-GN PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH 621.381046 LAU 1997 (Browse shelf(Opens below)) 15746 Available 0000016817
Book-GN Book-GN PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH 621.381046 LAU 1997 (Browse shelf(Opens below)) 15747 Available 0000016818
Book-GN Book-GN PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH 621.381046 LAU 1997 (Browse shelf(Opens below)) 15748 Available 0000016819

Includes bibliographical references and index

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