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Electronic packaging : design, materials, process, and reliability / John H. Lau...[et al.].
Material type:
TextSeries: Electronic packaging and interconnection seriesPublication details: New York McGraw Hill 1998.Description: xxiv. 498p. ill. 23cmISBN: - 0070371350
- 621.381046 ELE 1998
| Item type | Current library | Call number | Copy number | Status | Date due | Barcode |
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Book-GN
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PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH | 621.381046 ELE 1998 (Browse shelf(Opens below)) | 18243 | Available | 0000019332 | |
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Book-GN
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PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH | 621.381046 ELE 1998 (Browse shelf(Opens below)) | 18244 | Available | 0000019333 | |
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Book-GN
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PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH | 621.381046 ELE 1998 (Browse shelf(Opens below)) | 18245 | Available | 0000019334 |
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| 621.381046 DIG 1997 Reliability of electronic packages and semiconductor devices | 621.381046 ELE 1991 Electronics packaging forum; edited by James E. Morris. | 621.381046 ELE 1998 Electronic packaging : design, materials, process, and reliability | 621.381046 ELE 1998 Electronic packaging : design, materials, process, and reliability | 621.381046 ELE 1998 Electronic packaging : design, materials, process, and reliability | 621.381046 ELE 1999 Electronic packaging materials and their properties | 621.381046 FLI 1996 Flip chip technologies |
Includes bibliographical references and index
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