Quality conformance and qualification of microelectronic packages and interconnects / editors Michael Pecht (et...al).

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Material type: Text

TextPublication details: New York John Wiley & Sons, Inc 1993.Description: xxxiii, 461p. ill. 24cmISBN:

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Holdings
Item type	Current library	Call number	Copy number	Status	Date due	Barcode
Book-GN	PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH	621.381046 QUA 1993 (Browse shelf(Opens below))	4500	Available		0000005314

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Previous	621.381046 PEC 1994 Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability	621.381046 PEC 1994 Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability	621.381046 PEC 1994 Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability	621.381046 QUA 1993 Quality conformance and qualification of microelectronic packages and interconnects	621.381046 QUA 2007 Quantum-well laser array packaging : nanoscale packaging techniques	621.381046 TUM 2008 Introduction to system-on-package (SOP) : miniaturization of the entire system	621.3810685 SMI 1997 Optimizing quality in electronics assembly : a heretical approach	Next

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