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Ball grid array technology / editor, John H. Lau. by
  • Lau, John H
Series: Electronic packaging and interconnection series
Material type: Text Text
Publication details: New York McGraw-Hill, Inc. 1995
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 621.381046 BAL 1995.

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Electronic packaging : design, materials, process, and reliability / John H. Lau...[et al.]. by
  • Lau, John H
Series: Electronic packaging and interconnection series
Material type: Text Text
Publication details: New York McGraw Hill 1998
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (3)Call number: 621.381046 ELE 1998, ...

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Flip chip technologies / editor, John H. Lau. by
  • Lau, John H
Series: Electronic packaging and interconnection series
Material type: Text Text
Publication details: New York McGraw Hill 1996
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 621.381046 FLI 1996.

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