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		Reliability of electronic packages and semiconductor devices / Giulio Di Giacomo. by DI GIACOMO Series: Electronic packaging and interconnection series Material type: Text Publication details: New York McGraw Hill 1997 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (4)Call number: 621.381046 DIG 1997, ... Place hold Add to cart (remove)
		Modern solder technology for competitive electronics manufacturing / Jennie S. Hwang. by HWANG Series: Electronic packaging and interconnection series Material type: Text Publication details: New York McGraw Hill 1996 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (4)Call number: 621.381046 HWA 1996, ... Place hold Add to cart (remove)
		Printed circuit board materials handbook / Martin W. Jawitz, editor in chief. by Jawitz, Martin W Series: Electronic packaging and interconnection series Material type: Text Publication details: New York McGraw Hill 1997 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (5)Call number: 621.381531 PRI 1997, ... Place hold Add to cart (remove)
		Thermal management handbook : for electronic assemblies / Jerry E. Sergent, Al Krum. by Sergent Krum, Al Series: Electronic packaging and interconnection series Material type: Text Publication details: New York McGraw Hill 1998 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (6)Call number: 621.381 SER 1998, ... Place hold Add to cart (remove)
		DC power supplies : a technician guide / Joseph J. Carr. by Carr Series: Electronic packaging and interconnection series Material type: Text Publication details: [year of publication not identified] Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (3)Call number: 621.381044 CAR 1996, ... Place hold Add to cart (remove)
		Ball grid array technology / editor, John H. Lau. by Lau, John H Series: Electronic packaging and interconnection series Material type: Text Publication details: New York McGraw-Hill, Inc. 1995 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 621.381046 BAL 1995. Place hold Add to cart (remove)
		Hybrid microelectronics handbook / Jerry E. Sergent, Charles A. Harper. by Sergent Harper, Charles A Series: Electronic packaging and interconnection series Edition: 2nd ed.. Material type: Text Publication details: New York McGraw Hill 1995 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (3)Call number: 621.381 SER 1995, ... Place hold Add to cart (remove)
		Electronic connector handbook : theory and applications / Robert S. Mroczkowski. by Mroczkowski Series: Electronic packaging and interconnection series Material type: Text Publication details: New York McGraw Hill 1998 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (3)Call number: 621.38154 MRO 1998, ... Place hold Add to cart (remove)
		Electronic packaging : design, materials, process, and reliability / John H. Lau...[et al.]. by Lau, John H Series: Electronic packaging and interconnection series Material type: Text Publication details: New York McGraw Hill 1998 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (3)Call number: 621.381046 ELE 1998, ... Place hold Add to cart (remove)
		Flip chip technologies / editor, John H. Lau. by Lau, John H Series: Electronic packaging and interconnection series Material type: Text Publication details: New York McGraw Hill 1996 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 621.381046 FLI 1996. Place hold Add to cart (remove)