Chip scale package, CSP : design, materials, processes, reliability, and applications / John H. Lau, Shi-Wei Ricky Lee.

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Material type: Text

TextPublication details: New York McGraw Hill 1999.Description: xxii, 564p. ill. 25cmISBN:

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Holdings
Item type	Current library	Call number	Copy number	Status
Book-GN	PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH	621.3815 LAU 1999 (Browse shelf(Opens below))	16703	Available
Book-GN	PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH	621.3815 LAU 1999 (Browse shelf(Opens below))	16704	Available
Book-GN	PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH	621.3815 LAU 1999 (Browse shelf(Opens below))	16705	Available
Book-GN	PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH	621.3815 LAU 1999 (Browse shelf(Opens below))	18388	Available
Book-GN	PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH	621.3815 LAU 1999 (Browse shelf(Opens below))	18389	Available
Book-GN	PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH	621.3815 LAU 1999 (Browse shelf(Opens below))	18390	Available
Book-GN	PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH	621.3815 LAU 1999 (Browse shelf(Opens below))	23200	Available
Book-GN	PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH	621.3815 LAU 1999 (Browse shelf(Opens below))	23201	Available
Book-GN	PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH	621.3815 LAU 1999 (Browse shelf(Opens below))	23202	Available

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Previous	621.3815 KAE 2008 Digital integrated circuit design : from VLSI architectures to CMOS fabrication	621.3815 KHA 2006 A first course in electronics	621.3815 KUM 2008 Fabless semiconductor implementation	621.3815 LAU 1999 Chip scale package, CSP : design, materials, processes, reliability, and applications	621.3815 LAU 1999 Chip scale package, CSP : design, materials, processes, reliability, and applications	621.3815 LAU 1999 Chip scale package, CSP : design, materials, processes, reliability, and applications	621.3815 LAU 1999 Chip scale package, CSP : design, materials, processes, reliability, and applications	Next

Includes index

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