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Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies / authors, John H. Lau and Yi-Hsin Pao. by
  • Lau
  • Pao, Yi-Hsin
Material type: Text Text
Publication details: New York McGraw Hill 1997
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (4)Call number: 621.381046 LAU 1997, ...

Ball grid array technology / editor, John H. Lau. by
  • Lau, John H
Series: Electronic packaging and interconnection series
Material type: Text Text
Publication details: New York McGraw-Hill, Inc. 1995
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 621.381046 BAL 1995.

Accountancy mathematics for ITM / Lau Too Kya and Wee Kok Kiang. by
  • Lau
  • Wee, Kok Kiang
Material type: Text Text
Publication details: Kuala Lumpur Penerbitan Fajar Bakti 1996
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (4)Call number: 657.0460711595 LAU 1996, ...

Business mathematics for ITM / Lau Too Kya and Wee Kok Kiang. by
  • Lau
  • Wee, Kok Kiang
  • Institut Teknologi MARA
Material type: Text Text
Publication details: Kuala Lumpur Fajar Bakti 1996
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (3)Call number: 650.01513 LAU 1996, ...

Chip scale package, CSP : design, materials, processes, reliability, and applications / John H. Lau, Shi-Wei Ricky Lee. by
  • Lau
  • Lee, Shi-Wei Ricky
Material type: Text Text
Publication details: New York McGraw Hill 1999
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (9)Call number: 621.3815 LAU 1999, ...

Electronic packaging : design, materials, process, and reliability / John H. Lau...[et al.]. by
  • Lau, John H
Series: Electronic packaging and interconnection series
Material type: Text Text
Publication details: New York McGraw Hill 1998
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (3)Call number: 621.381046 ELE 1998, ...

Statistik asas UiTM / Lau Too Kya, Zainuddin Awang. by
  • Lau
  • Zainuddin Awang
Material type: Text Text
Publication details: Shah Alam Fajar Bakti 1994
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (11)Call number: 519.50711 LAU 1994, ...

Capital control and the Malaysian Economy / Lau Ban Tin. by
  • Lau
Material type: Text Text
Publication details: Subang Jaya Pelanduk Publications 2005
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 332.63209595 LAU 2005.

Slope stability analysis and stabilization : new methods and insight / Y. M. Cheng and C. K. Lau. by
  • Cheng
  • Lau, C. K
Material type: Text Text
Publication details: London Routledge 2008
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 624.151363 CHE 2008.

Business marketing : an Asian perspective / Lau Geok Theng. by
  • Lau, Geok Theng
Material type: Text Text
Publication details: Singapore McGraw-Hill 2007
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 658.8 LAU 2007.

Statistics for UiTM / Lau Too Kya, Phang Yook Ngor, Zainudin Awang. by
  • Lau, Too Kya
  • Phang, Yook Ngor
  • Zainudin Awang
Edition: 3rd ed..
Material type: Text Text
Publication details: Shah Alam Oxford Fajar 2012
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (3)Call number: 519.50711 LAU 2012, ...

Statistics for UiTM / Lau Too Kya, Phang Yook Ngor, Zainudin Awang. by
  • Lau, Too Kya
  • Phang, Yook Ngor
  • Zainudin Awang
Edition: 4th ed..
Material type: Text Text
Publication details: Shah Alam Oxford Fajar 2015
Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (2)Call number: 519.50711 LAU 2015, ...

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