Your search returned 94 results.

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		LED packaging for lighting applications : design, manufacturing and testing / Sheng Liu, Xiaobing Luo. by Liu, S., 1963- (Sheng) Luo, Xiaobing, 1974- Material type: Text Publication details: Singapore John Wiley & Sons (Asia) 2011 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 621.381522 LIU 2011. Place hold Add to cart (remove)
		Semiconductor packaging : materials interaction and reliability / Andrea Chen, Randy Hsiao-Yu Lo. by Chen, Andrea Lo, Randy Material type: Text Publication details: Boca Raton, FL CRC Press c2012 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 621.38152 CHE 2012. Place hold Add to cart (remove)
		Packaging design : successful product branding from concept to shelf / Marianne Rosner Klimchuk and Sandra A. Krasovec. by Klimchuk, Marianne Rosner Krasovec, Sandra A Material type: Text Publication details: Hoboken, N.J. J. Wiley & Sons c2006 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 658.564 KLI 2006 . Place hold Add to cart (remove)
		Adhesives technology for electronic applications : materials, processing, reliability / James J. Licari and Dale W. Swanson. by Licari, James J, 1930- Swanson, Dale W Series: Materials and processes for electronic applications series Edition: 2nd ed.. Material type: Text Publication details: Waltham William Andrew Pub. c2011 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 621.381 LIC 2011. Place hold Add to cart (remove)
		Multichip module technology handbook / Philip E. Garrou, Iwona Turlik. by Garrou Turlik, Iwona Material type: Text Publication details: New York McGraw Hill 1998 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (5)Call number: 621.381 GAR 1998, ... Place hold Add to cart (remove)
		Reliability of electronic packages and semiconductor devices / Giulio Di Giacomo. by DI GIACOMO Series: Electronic packaging and interconnection series Material type: Text Publication details: New York McGraw Hill 1997 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (4)Call number: 621.381046 DIG 1997, ... Place hold Add to cart (remove)
		Modern solder technology for competitive electronics manufacturing / Jennie S. Hwang. by HWANG Series: Electronic packaging and interconnection series Material type: Text Publication details: New York McGraw Hill 1996 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (4)Call number: 621.381046 HWA 1996, ... Place hold Add to cart (remove)
		Package & label design. Series: Motif design Material type: Text Publication details: Massachusetts Rockport Publishers 1997 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 741.692 PAC 1997. Place hold Add to cart (remove)
		Thermal management handbook : for electronic assemblies / Jerry E. Sergent, Al Krum. by Sergent Krum, Al Series: Electronic packaging and interconnection series Material type: Text Publication details: New York McGraw Hill 1998 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (6)Call number: 621.381 SER 1998, ... Place hold Add to cart (remove)
		Multichip module design, fabrication and testing / James J. Licari. by Licari Material type: Text Publication details: New York McGraw Hill 1995 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 621.381046 LIC 1995. Place hold Add to cart (remove)
		Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies / authors, John H. Lau and Yi-Hsin Pao. by Lau Pao, Yi-Hsin Material type: Text Publication details: New York McGraw Hill 1997 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (4)Call number: 621.381046 LAU 1997, ... Place hold Add to cart (remove)
		Quality conformance and qualification of microelectronic packages and interconnects / editors Michael Pecht (et...al). by Pecht, Michael Material type: Text Publication details: New York John Wiley & Sons, Inc 1993 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 621.381046 QUA 1993. Place hold Add to cart (remove)
		Electronic packaging and interconnection handbook / editor-in-chief, Charles A. Harper. by Harper, Charles A Series: Electrical packaging and interconnection series Edition: 2nd ed.. Material type: Text Publication details: New York McGraw Hill 1997 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (3)Call number: 621.381046 ELE 1997, ... Place hold Add to cart (remove)
		The handbook of machine soldering : SMT and TH / Ralph W. Woodgate. by Woodgate Edition: 3rd ed.. Material type: Text Publication details: New York John Wiley & Sons 1996 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 621.381531 WOO 1996. Place hold Add to cart (remove)
		The Wiley encyclopedia of packaging technology / edited by Aaron L. Brody, Kenneth S. Marsh. by Brody, Aaron L Marsh, Kenneth S Edition: 2nd. ed.. Material type: Text Publication details: New York John Wiley & Sons 1997 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (1)Call number: 688.903 WIL 1997. Place hold Add to cart (remove)
		Thin film technology handbook / Aicha A. R. Elshabini-Riad, Fred D. Barlow III. by Elshabini-Riad Barlow, Fred D Series: Electronic packaging and interconnect series Material type: Text Publication details: New York McGraw-Hill 1998 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (3)Call number: 621.38152 ELS 1998, ... Place hold Add to cart (remove)
		Air cooling technology for electronic equipment / edited by Sung Jin Kim, Sang Woo Lee. by Kim, Sung Jin Lee, Sang Woo Material type: Text Publication details: New York CRC Press, Inc 1996 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (3)Call number: 621.381 AIR 1996, ... Place hold Add to cart (remove)
		Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability / Michael Pecht. by Pecht Material type: Text Publication details: New York John Wiley & Sons 1994 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (3)Call number: 621.381046 PEC 1994, ... Place hold Add to cart (remove)
		Chip scale package, CSP : design, materials, processes, reliability, and applications / John H. Lau, Shi-Wei Ricky Lee. by Lau Lee, Shi-Wei Ricky Material type: Text Publication details: New York McGraw Hill 1999 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (9)Call number: 621.3815 LAU 1999, ... Place hold Add to cart (remove)
		Electronic packaging : design, materials, process, and reliability / John H. Lau...[et al.]. by Lau, John H Series: Electronic packaging and interconnection series Material type: Text Publication details: New York McGraw Hill 1998 Availability: Items available for loan: PERPUSTAKAAN POLITEKNIK SULTAN SALAHUDDIN ABDUL AZIZ SHAH (3)Call number: 621.381046 ELE 1998, ... Place hold Add to cart (remove)

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Your search returned 94 results.